Thermophysical Properties of Platinum-Copper Alloys

Platinum and copper along with their alloys have been used in a broad range of applications including jewelry, coinage, electrical and electronic devices, and many others. Their thermophysical properties play an important role in casting processes and are required as input data for casting simulation. The focus of this work was to investigate these properties by different methods. Platinum, copper, and four platinum-copper alloys, namely, Pt96Cu04, Pt68Cu32, Pt50Cu50, and Pt25Cu75, were investigated within this work. The melting range and thermal expansion were measured at fem by differential scanning calorimetry and dilatometry, respectively. At TU Graz, wire-shaped samples were investigated by an ohmic pulse heating technique. This technique delivers thermophysical properties of electrically conducting materials far into the liquid phase. These measurements allow the calculation of specific heat capacity and the temperature dependencies of electrical resistivity, enthalpy, and density of these alloys in the solid and liquid phases. Thermal conductivity and thermal diffusivity as a function of temperature are estimated from resistivity data using the Wiedemann?CFranz law at the end of the solid phase and at the beginning of the liquid phase. The results are compared with the available literature values.