| 低温无铅焊料焊接的现状和未来展望 |
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| 引用本文： | 蔡积庆. 低温无铅焊料焊接的现状和未来展望[J]. 印制电路信息, 2009, 0(1): 65-69 |
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| 作者姓名： | 蔡积庆 |
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| 作者单位： | 江苏南京210018 |
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| 摘 要： | 概述了低温无铅焊料安装的现状和可靠性课题以及未来实现低温安装的途径。
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| 关 键 词： | 低温无铅焊料 安装 现状 可靠性 |
Present Situation and Future Development of Low Temperature Lead-free Solder Mounting |
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| CAI Ji-qing. Present Situation and Future Development of Low Temperature Lead-free Solder Mounting[J]. Printed Circuit Information, 2009, 0(1): 65-69 |
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| Authors: | CAI Ji-qing |
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| Affiliation: | CAI Ji-qing |
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| Abstract: | This paper describes the present situation and reliabilily theme of low temperature Pb-free solder mounting,aucl approach of carry out low temperature mounting. |
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| Keywords: | low temperature Pb-free solder mounting present situation reliability theme |
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