|
|||||
|
|
| Simulation and analysis of effects of Young’s modulus of isolation material on natural frequencies of the sensor package and displacement of the chip | |
| 作者姓名： | 殷景华 吕光军 刘晓为 雷清泉 |
| 作者单位： | Dept. of Electronic Science and Technology，Harbin University of Science and Technology，Harbin 150080，China，Dept. of Electronic Science and Technology，Harbin University of Science and Technology，Harbin 150080，China，MEMS Center，Harbin Institute of Technology，Harbin 150001，China，Dept. of Electronic Science and Technology，Harbin University of Science and Technology，Harbin 150080，China |
| 基金项目： | Sponsored by the Creativity Ability Fund Project for Cadreman of General Provincial University of Heilongjiang(Grant No.1053G033). |
| 摘 要： | During the last ten years, Micro-electromechanicalSystems (MEMS) technology developed very rapidlyand with that came great achievements. Currently, theMEMS devices are different types of sensors, which areusually applied to measure physical quantities such aspressure, the acoustic signal, mass, motion, accelera-tion, rotation, velocity of flow, chemical reaction, vi-bration, and so on. Additionally, some sensors havebeen manufactured[1]. MEMS packaging technologydevelops slowly due to the… |
| 本文献已被 CNKI 等数据库收录！ | |