| 金属间化合物对SnAgCu/Cu界面破坏行为的影响 |
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| 引用本文： | 李晓延,严永长,史耀武. 金属间化合物对SnAgCu/Cu界面破坏行为的影响[J]. 机械强度, 2005, 27(5): 666-671 |
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| 作者姓名： | 李晓延 严永长 史耀武 |
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| 作者单位： | 北京工业大学,材料学院,北京,100022;北京工业大学,材料学院,北京,100022;北京工业大学,材料学院,北京,100022 |
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| 基金项目： | 国家自然科学基金（50475043）;北京市自然科学基金（2052006）和教育部博士点基金（20040005012）资助项目. |
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| 摘 要： | 无铅焊接与封装是对新一代电子产品的基本要求，SnAgCu系合金是最有可能替代SnPb焊料的无铅焊料。SnAgCu—Cu界面金属间化合物（intermetallic components，IMC）的形成与生长对电了产品的性能和可靠性有重要影响。文中讨论SnAgCu—Cu界面IMC的形貌及绀织演变，介绍SnAgCu—Cu界面IMC的形成、生长机理和表征办法，分析IMC对SnAgCu—Cu界面破坏行为的影响。
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| 关 键 词： | 无铅焊料 金属间化合物(IMC) 断裂 表面组装 电子封装 |
| 收稿时间： | 2005-05-10 |
| 修稿时间： | 2005-05-102005-06-01 |
INFLUENCE OF IMC ON THE INTERFACE FAILURE OF TIN-SILVER-COPPER SOLDER JOINTS |
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| LI XiaoYan,YAN YongChang,SHI YaoWu. INFLUENCE OF IMC ON THE INTERFACE FAILURE OF TIN-SILVER-COPPER SOLDER JOINTS[J]. Journal of Mechanical Strength, 2005, 27(5): 666-671 |
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| Authors: | LI XiaoYan YAN YongChang SHI YaoWu |
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| Abstract: | Pb-free soldering is a basic requirement for new generation electronic packages. The Sn-Ag-Cu serials solders are widely recommended, by researches and electronic manufacturers, to be used as the substitutes of SnPb solder. However, the formation and growth of the intermetallic components (IMC) at the interface of SnAgCu solder and the Cu substrate are proven to exhibit a significant effect on the bounding strength and failure behavior of the joints. The morphological characteristics and the microstructure evolution of the IMCs were presented, the mechanism and the characterization of the IMCs as well as their influence on interface failure were also analyzed. |
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| Keywords: | Lead-free solder Intermetallic compound (IMC) Fracture Surface mounting technology (SMT) Electronic package |
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