| Abstract: | In the process of microwave curing of an adhesive‐bonded joint, both the adhesive layer and the adherends affected the heating efficiency of the joint. As an extension of previous studies, the influences of changing the properties of the components of the joint on the heating efficiency were predicted by simulations that were based on the numerical model developed previously. The influence of adhesive thickness was also studied. The properties that directly affected power dissipation and heat loss of the adhesive layer were found to be important to the heating efficiency of the process. The heating rate was also sensitive to the thickness of the adhesive layer. Polym. Eng. Sci. 44:1414–1418, 2004. © 2004 Society of Plastics Engineers. |
