| 集成电路制造用溅射靶材 |
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| 引用本文： | 尚再艳,江轩,李勇军,杨永刚. 集成电路制造用溅射靶材[J]. 稀有金属, 2005, 29(4): 475-477 |
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| 作者姓名： | 尚再艳 江轩 李勇军 杨永刚 |
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| 作者单位： | 北京有色金属研究总院,有研亿金新材料股份有限公司,北京,102200 |
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| 基金项目： | 北京市科学技术委员会专项基金资助项目(D0405001040431) |
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| 摘 要： | 溅射靶材常用于半导体产业、记录媒体产业和先进显示器产业。在不同产业中,半导体集成电路制造业对溅射靶材的质量要求最高。对用于集成电路制造的溅射靶材的材质类型、纯度要求、外形发展进行了阐述,并讨论了溅射靶材微观组织对溅射薄膜性质的影响,以及靶材中夹杂物、晶粒尺寸、晶粒取向的控制方法。
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| 关 键 词： | 集成电路 溅射 靶材 半导体 |
| 文章编号： | 0258-7076(2005)04-0475-03 |
| 修稿时间： | 2005-06-28 |
Sputtering Targets Used in Integrated Circuit |
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| Shang Zaiyan,JIANG Xuan,Li Yongjun,Yang Yonggang. Sputtering Targets Used in Integrated Circuit[J]. Chinese Journal of Rare Metals, 2005, 29(4): 475-477 |
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| Authors: | Shang Zaiyan JIANG Xuan Li Yongjun Yang Yonggang |
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| Affiliation: | Shang Zaiyan*,Jiang Xuan,Li Yongjun,Yang Yonggang |
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| Abstract: | Sputtering target materials are often used insemiconductor ,recording mediumand advanced display.Inthe different industries ,the quality of sputteringtargetmaterials usedin semiconductor integrated circuit is con-trolled most strictly. The material types ,purity demandand shape development trend of sputteringtargets usedinIC were reviewed. The influences of sputtering targets ,microstructure upon the quality of sputtering film werediscussed. Moreover , howto control inclusions , grainsizes and orientation of sputtering targets were discussedalso. |
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| Keywords: | integrated circuit sputter target semiconductor |
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