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一种用于三层布线的分层算法
引用本文:钟琳 申林. 一种用于三层布线的分层算法[J]. 微电子学, 1989, 19(2): 14-19
作者姓名:钟琳 申林
作者单位:重庆大学(钟琳,申林),重庆大学(童頫)
基金项目:国家自然科学基金,国家“八六三”高技术计划资助
摘    要:随着VLSI/LSI技术的发展,多层布线已能够实现。互连网络的分层问题就是要使得互连网络所需的通孔数最少。在通孔最小化问题中,如果布图拓扑逻辑已给出,这类问题被称为受限的通孔最小化(CVM)问题。本文针对三层布线中的CVM问题提出了一种分层算法,使得布图所需的通孔数最小化。应用此算法能获得比文献中所述更少的通孔数。

关 键 词:集成电路 三层分布 分层算法

An Algorithm for Layer Assignment of a Three-layer Channel Routing
Zhong Lin,Shen Lin and Tong Fu. An Algorithm for Layer Assignment of a Three-layer Channel Routing[J]. Microelectronics, 1989, 19(2): 14-19
Authors:Zhong Lin  Shen Lin  Tong Fu
Affiliation:Chongqing University
Abstract:With the development of VLSI/LSI and the realization of multi-layer routing, the layer assignment for interconnects, which is to minimize the number of vias required for wiring signal nets,has become mcreasingly important.In via minimization, this problem is referred to as a constrained via minimization(CVM)when the topology of the given layout is fixed. In this paper, a new algorithm for CVM of a three-layer routing is presented. Number of vias fewer than that published in the literature ( 1 )and ( 3 ) has been accomplished with this algorithm.
Keywords:Via routing   VLSI layout. Three-layer routing   Layer assignment   Via minimization
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