| HDI印制板二阶微盲填孔的构建研究 |
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| 引用本文： | 苏新虹,周国云,王守绪,何为.HDI印制板二阶微盲填孔的构建研究[J].电子元件与材料,2011,30(10):72-75. |
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| 作者姓名： | 苏新虹 周国云 王守绪 何为 |
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| 作者单位： | 1. 珠海方正多层线路板科技有限公司,广东珠海,519100
2. 电子科技大学电子薄膜与集成器件国家重点实验室,四川成都,610054 |
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| 基金项目： | 国家火炬计划资助项目(No.2008GH011435) |
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| 摘 要： | 随着电子产品向小型化、轻量化及薄型化发展,HDI (High Density Interconnect)印制电路板更多地开始选用二阶及二阶以上微埋盲孔.对HDI二阶微盲孔对位、填铜药水成分及工艺参数等进行研究,得出了填孔过程中各参数的选择原则,并获得了对位精度为50μm,Dimple(下陷)低于10 μm的二阶微盲孔H...
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| 关 键 词： | HDI 微盲孔 二阶对位 填铜 |
Fabricating research of two-depth micro blind via with copper filled in HDI PCB |
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| SU Xinhong,ZHOU Guoyun,WANG Shouxu,HE Wei.Fabricating research of two-depth micro blind via with copper filled in HDI PCB[J].Electronic Components & Materials,2011,30(10):72-75. |
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| Authors: | SU Xinhong ZHOU Guoyun WANG Shouxu HE Wei |
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| Affiliation: | SU Xinhong1,ZHOU Guoyun2,WANG Shouxu2,HE Wei2(1.Zhuhai Founder PCB Technology Co.,Ltd,Zhuhai 519100,Guangdong Province,China,2.State Key Laboratory of Electronic Film and Integrated Devices,University of Electronic Science and Technology,Chengdu 610054,China) |
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| Abstract: | With the development of electronic product miniaturizing,lighting and thinning,buried and blind via structures were widely used in HDI printed circuit boards(PCB).The registration between first and second depth blind via,and the copper filling process of blind via etc.were studied.With the results above,the principles to determine the best parameters in copper filling process and high performance HDI PCB with two-depth blind via were obtained with the registration precision within 50 μm and the dimple below 10 μm.After the reliability testing of IPC—TM—650 standard,the HDI PCB with two-depth via exhibits good qualification in all indicators and reaches IPC—6016 standard. |
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| Keywords: | HDI micro blind via two-depth registration copper filling |
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