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| 低银无铅焊料的研制动态 | |
| 引用本文： | 刘平,顾小龙,赵新兵,刘晓刚.低银无铅焊料的研制动态[J].电子元件与材料,2011,30(9):82-85. |
| 作者姓名： | 刘平 顾小龙 赵新兵 刘晓刚 |
| 作者单位： | 1. 浙江省冶金研究院有限公司浙江省钎焊材料与技术重点实验室,浙江杭州 310011;浙江大学材料科学与工程学系,浙江杭州 310027 2. 浙江省冶金研究院有限公司浙江省钎焊材料与技术重点实验室,浙江杭州,310011 3. 浙江大学材料科学与工程学系,浙江杭州,310027 |
| 基金项目： | 浙江省2010年自然科学基金资助项目(No.Y4100809) |
| 摘 要： | 分析了低银无铅焊料(w(Ag)≤1.0％)在成本、抗跌落性能、Ag3Sn化合物的形成等方面与高银焊料相比的优势,综述了低银焊料在应用过程中面临的问题,如高熔点与氧化、热疲劳性能、返修缺陷等,并列举了实例,提出了一些有针对性的解决方案.最后展望了低银无铅焊料的发展趋势. |
| 关 键 词： | 低银无铅焊料 性能 综述 研制 |
Development status of low-Ag lead free solders |
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| LIU Ping,GU Xiaolong,ZHAO Xinbing,LIU Xiaogang.Development status of low-Ag lead free solders[J].Electronic Components & Materials,2011,30(9):82-85. | |
| Authors: | LIU Ping GU Xiaolong ZHAO Xinbing LIU Xiaogang |
| Affiliation: | LIU Ping1,2,GU Xiaolong1,ZHAO Xinbing2,LIU Xiaogang1(1.Zhejiang Province Key Laboratory of Soldering & Brazing Materials and Technology,Zhejiang Metallurgical Research Institute,Hangzhou 310011,China,2.Department of Materials Science and Engineering,Zhejiang University,Hangzhou 310027,China) |
| Abstract: | The advantages of low-Ag lead free solders(w(Ag)≤1.0%) are analyzed from aspects of cost,amti-dropping capability,and Ag3Sn forming in the solder bulk by comparing to those of high-Ag lead free solders.Some problems of low-Ag lead free solders in application,such as high melting point,thermal fatigue property,rework defects,are summarized,and some solutions are presented.Finally,the prospects of low-Ag lead free solders are proposed. |
| Keywords: | low-Ag lead-free solder property review development |
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