| 一种LQFP64引线框架封装的优化设计 |
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| 引用本文： | 孙海燕,孙玲. 一种LQFP64引线框架封装的优化设计[J]. 电子与封装, 2011, 11(9): 1-4 |
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| 作者姓名： | 孙海燕 孙玲 |
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| 作者单位： | 南通大学专用集成电路设计重点实验室,江苏南通,226019 |
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| 基金项目： | 核高基重大专项分课题(2009ZX01031-002-002-002); 国家自然科学基金项目(61040032); 江苏省自然科学基金项目(BK2009153); 江苏省教育厅高校科研成果产业化推进项目(JHZD10-036) |
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| 摘 要： | 工艺简单、成本低廉是引线框架封装的优点，但引线框架的固定结构限制了其应用带宽。文中利用HFSS软件完成了一种标准的LQFP64引线框架的优化建模和S参数仿真。结果表明，该LQFP64优化模型以较低的封装成本提高了射频／微波集成电路的封装带宽，其回波损耗S31在4．7GHz为-1dB、插入损耗S11在4．9GHz为-15...
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| 关 键 词： | 集成电路封装 LQFP 电磁建模 寄生效应 |
An Improved 64-lead Low-profile Quad Flat Package |
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| SUN Hai-yan,SUN Ling. An Improved 64-lead Low-profile Quad Flat Package[J]. Electronics & Packaging, 2011, 11(9): 1-4 |
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| Authors: | SUN Hai-yan SUN Ling |
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| Affiliation: | SUN Hai-yan,SUN Ling(Jiangsu Provincial Key Lab of ASIC Design,Nantong University,Nantong 226019,China) |
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| Abstract: | Simple process and low cost are the two major advantages of lead frame package,but the application bandwidth has been limited by its fixed structure.Based on a standard 64-lead low-profile quad flat package,HFSS was used to create optimized package model and simulate for S parameters.The simulation results show that the optimized model has extended the RFIC/MMIC package bandwidth to higher frequencies at lower cost.The bandwidth measured for insertion loss(S31),return loss(S11),and coupling(S21)is 4.7GHz(at... |
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| Keywords: | integrated circuit package LQFP electromagnetic modeling parasitic effect |
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