Finite element analysis (FEA) modelling and experimental verification to optimise flexible electronic packaging for e-textiles |
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| Authors: | Li Menglong Torah Russel Liu Jingqi Tudor John Beeby Steve |
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| Affiliation: | 1.Department of Electronic and Computer Science, University of Southampton, Southampton, UK
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| Abstract: | Microsystem Technologies - In this paper a three-dimensional model of a novel electronic package has been developed using Finite element analysis to evaluate the shear load, tensile, bending and... |
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