Investigations on the damage caused by ion etching of SiO2 layers at low energy and high dose

The radiation damage caused by argon ion bombardment during ion etching of thermally grown SiO₂ films at an energy below 1 keV and a dose of about 10¹⁸ cm^?2 has been studied by evaluating MOS C-V curves, FET characteristics, as well as Rutherford ion backscattering spectra. The bombarded samples revealed that ion beam etching in this energy range causes a damaged layer of 5–10 nm thickness at the single crystal silicon surface. Moreover, traces of metal atoms are found in the damaged layer together with argon atoms (≈ 10²¹cm^?3).