Investigation of Bonding Behavior of AA1050/AA5083 Bimetallic Laminates by Roll Bonding Technique

In this study, 1-mm AA1050/AA5083 bimetallic laminates were produced using roll bonding (RB) process. The RB process was carried out with thickness reduction ratios of 25, 50 and 75%, separately. Finite element simulation was used to model the deformation of bimetallic laminates for various experimental conditions. Particular attention was focused on the bonding of the interface between AA1050 and AA5083 layers in the simulation. The optimization of thickness reduction ratios was obtained for improvement of the bond strength of bimetallic laminates during RB process. During the simulation, the mean equivalent strain at the interface zone between the layers was found to reach the maximum value with a high quality bond for the sample produced with 75% of thickness reduction. Moreover, the fracture surface of samples around the interface of laminates after the tensile test was studied to investigate the bonding quality by scanning electron microscopy.