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An alternative method for metallization by laser and ion beam irradiation
Authors:F. Machalett   K. Edinger   M. Diegel  K. Steenbeck
Affiliation:

a Institut für Festkörperphysik, Friedrich-Schiller-Universität Jena, Max-Wien-Platz 1, D-07743 Jena, Germany

b Institute for Plasma Research, University of Maryland, College Park, MD 20742, USA

c Institut für Physikalische Hochtechnologie e.V., Winzerlaer Strasse 10, D-07745 Jena, Germany

Abstract:A scanning Ar+ laser beam and a focused 30 keV Ga+ ion beam (FIB) have been used to transform an insulating (or high-resistivity semiconducting) noble metal oxide film to a conducting layer. Resulting from these experiments we propose a method for the fast and one-step metallization by laser or ion beam irradiation using platinum oxide thin films, prepared by magnetron sputtering under an argon/oxygen plasma. A maskless patterning of the platinum oxide film is possible by scanned laser and focused ion beam irradiation. Additionally to the scanning methods it is also possible to pattern the PtO2 film by broad ion beam irradiation using masks. For wiring we patterned conducting areas of up to 2 mm width and up to 15 mm length with a broad Ga+ ion beam (energy: 300 keV, dose: 5×1015 Ga+/cm2). The laser- and the ion-patterned large areas could be easily bonded with an Al wire to carry out four-point resistance measurements.
Keywords:Laser application   Ion irradiation   Metallization   Interconnects
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