Thermomechanical simulations of the transient coupled effect of thermal cycling and oxidation on residual stresses in thermal barrier coatings

Failures in thermal barrier coatings (TBCs) are associated with the build-up of residual stresses that result from thermal cycling, growth strain, and stress relaxation associated with high temperatures. To address these highly coupled processes, three aspects were examined. The first was concerned with the effect of thermal cycling and thermal gradients on the resulting residual stress fields. The second with the dynamic growth of thermally grown oxide (TGO) layer using novel finite volume-finite element algorithms. In the third, we examined the effect of stress relaxation on the (TC/TGO) interface. We modelled these highly coupled processes using transient thermomechanical finite element simulations. The temperature profile and state of oxidation variation with time were imported as a predefined field and solved in ANSYS nonlinear platform. Our results revealed that stress relaxation of the TGO stresses at high temperatures leads to a reduction in the TC/TGO interfacial stresses. They also revealed that the use of the isotropic hardening rule limits the increase in plastic deformation of the bond coat (BC), while the use of kinematic hardening rule leads to ratcheting. Furthermore, we highlighted the importance of considering uneven growth of TGO on the resulting stress field.