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Enhancing flow boiling heat transfer in microchannels for thermal management with monolithically-integrated silicon nanowires
Authors:Li D  Wu G S  Wang W  Wang Y D  Liu Dong  Zhang D C  Chen Y F  Peterson G P  Yang Ronggui
Affiliation:Department of Mechanical Engineering, University of Colorado, Boulder, Colorado 80309, United States.
Abstract:Thermal management has become a critical issue for high heat flux electronics and energy systems. Integrated two-phase microchannel liquid-cooling technology has been envisioned as a promising solution, but with great challenges in flow instability. In this work, silicon nanowires were synthesized in situ in parallel silicon microchannel arrays for the first time to suppress the flow instability and to augment flow boiling heat transfer. Significant enhancement in flow boiling heat transfer performance was demonstrated for the nanowire-coated microchannel heat sink, such as an early onset of nucleate boiling, a delayed onset of flow oscillation, suppressed oscillating amplitudes of temperature and pressure drop, and an increased heat transfer coefficient.
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