快速热退火在Si中引入缺陷的研究(英文)

An Investigation of the Defects in Silicon introduced by Rapid Thermal Annealing

The deep-level defects are introduced into n-type silicon by rapid thermal annealing (RTA). The kinds of the defects and thier densities vary with rapid annealing temperature. The minority carrier lifetime is reduced rapidly due to these defects. There are two kinds of the defects: one is related to the metal impurity frozen into the crystal lattice defect: which can be removed by subsequent annealing near 650℃, the other is related to the intrinsic defect of the crystal, which remains after subsequent annealing. Our results show that latter is associated with dislocation.