Interfacial microstructure of Si3N4/Si3N4 brazing joint with Cu–Zn–Ti filler alloy |
| |
| Authors: | J. Zhang X.M. Zhang Y. Zhou M. Naka Atroshenko Svetlana |
| |
| Affiliation: | aSchool of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001, China;bJoining and Welding Research Institute, Osaka University, Ibaraki, Osaka 567-0047, Japan;cFaculty of Mathematics and Mechanics, Saint-Petersburg State University, Russia |
| |
| Abstract: | In this study, Si3N4 ceramic was jointed by a brazing technique with a Cu–Zn–Ti filler alloy. The interfacial microstructure between Si3N4 ceramic and filler alloy in the Si3N4/Si3N4 joint was observed and analyzed by using electron-probe microanalysis, X-ray diffraction and transmission electron microscopy. The results indicate that there are two reaction layers at the ceramic/filler interface in the joint, which was obtained by brazing at a temperature and holding time of 1223 K and 15 min, respectively. The layer nearby the Si3N4 ceramic is a TiN layer with an average grain size of 100 nm, and the layer nearby the filler alloy is a Ti5Si3Nx layer with an average grain size of 1–2 μm. Thickness of the TiN and Ti5Si3Nx layers is about 1 μm and 10 μm, respectively. The formation mechanism of the reaction layers was discussed. A model showing the microstructure from Si3N4 ceramic to filler alloy in the Si3N4/Si3N4 joint was provided as: Si3N4 ceramic/TiN reaction layer/Ti5Si3Nx reaction layer/Cu–Zn solution. |
| |
| Keywords: | Si3N4 ceramic Brazing Cu– Zn– Ti filler alloy Interfacial microstructure |
| 本文献已被 ScienceDirect 等数据库收录！ |
|
