The growth of interfacial compounds between titanium dioxide and bismuth oxide

The growth of interfacial compounds between TiO₂ and Bi₂O₃ during transient liquid phase bonding at 900, 1000 and 1100 °C for various times was investigated. The microstructures and compositions of compounds in joints were analyzed by means of SEM and EPMA. It was found that the compound Bi₄Ti₃O₁₂ forms initially and replaces the Bi₂O₃ interlayer. Bi₂Ti₄O₁₁ then arises at the interface between Bi₄Ti₃O₁₂ and TiO₂ and the metastable Bi₂Ti₂O₇ phase appears last at the interface between Bi₄Ti₃O₁₂ and Bi₂Ti₄O₁₁. The modes and activation energies of the growth of Bi₄Ti₃O₁₂ and Bi₂Ti₄O₁₁ were determined respectively. Holes in the middle of the joint heated at 1100 °C for 24 h were also found.