| 微电子互连用导电胶研究进展 |
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| 引用本文： | 肖久梅,黄继华.微电子互连用导电胶研究进展[J].中国胶粘剂,2004,13(6):43-48. |
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| 作者姓名： | 肖久梅 黄继华 |
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| 作者单位： | 北京科技大学,北京市,100083 |
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| 摘 要： | 导电胶具备无铅、分辨率高、柔韧性好、加工工艺简单、低温操作等优点而使其成为替代传统Sn/Pb钎料的理想的微电子互连材料。本文对微电子互连用导电胶的组成、分类、机理和研究现状等进行了综述。为进一步研究开发新型性/价比高的微电子互连用导电胶提供思路。
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| 关 键 词： | 导电胶 微电子 微电子互连 综述 |
| 文章编号： | 1008-2849(2004)06-0043-06 |
| 修稿时间： | 2004年2月3日 |
Progress in conductive adhesives for microelectronic interconnection |
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| XIAO Jiu-mei,HUANG Ji-hua.Progress in conductive adhesives for microelectronic interconnection[J].China Adhesives,2004,13(6):43-48. |
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| Authors: | XIAO Jiu-mei HUANG Ji-hua |
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| Abstract: | Conductive adhesives have become ideal microelectronic interconnection materials replacing Sn/Pb solders because of the advantages of being lead-free, offering finer pitch interconnection capability, excellent flexibility and less processing steps at lower temperature. The composition, classification, conductivity mechanism, advance of conductive adhesives are reviewed here to support ideas for developing new conductive adhesives as microelectronic interconnection materials with excellent properties/cost ratio. |
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| Keywords: | Conductive adhesive microelectronic microelectronic interconnection review |
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