| 影响多层HDI板特性阻抗的其它因素 |
| |
| 引用本文： | 高峰鸽.影响多层HDI板特性阻抗的其它因素[J].无线通信技术,2011,20(2):54-56,61. |
| |
| 作者姓名： | 高峰鸽 |
| |
| 作者单位： | 中兴通讯股份有限公司手机产品体系,西安,710065 |
| |
| 摘 要： | 本文分析了影响多层HDI板特性阻抗的其它因素,重点讨论了针对多层HDI板计算PCB带状线的特性阻抗及如何在设计中规避PCB加工所带来的负面影响。
|
| 关 键 词： | HDI板 特性阻抗 带状线 |
Other Factor Which Impacting Multilayer HDI Board Characteristic Impedance |
| |
| GAO Feng-ge.Other Factor Which Impacting Multilayer HDI Board Characteristic Impedance[J].Wireless Communication Technology,2011,20(2):54-56,61. |
| |
| Authors: | GAO Feng-ge |
| |
| Affiliation: | GAO Feng-ge(Handset Product Division of ZTE Corporation,Xi'an 710065,China) |
| |
| Abstract: | This paper analyzes other factors which impacting multi-layer HDI board characteristic impedance,we are focusing on the calculation for PCB strip line characteristic impedance on multi-layer HDI boards and how to avoid the negative effects of machining in PCB design process. |
| |
| Keywords: | HDI board characteristic impedance strip line |
| 本文献已被 CNKI 万方数据 等数据库收录！ |
