| Flip-chip芯片关键技术的研究 |
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| 引用本文： | 芮延年,刘开强,张志伟,陈慧萍.Flip-chip芯片关键技术的研究[J].苏州大学学报(工科版),2004,24(5):19-22. |
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| 作者姓名： | 芮延年 刘开强 张志伟 陈慧萍 |
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| 作者单位： | 苏州大学机电工程学院,江苏,苏州,215021 |
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| 摘 要： | Flip-chip是一种微电子制造表面贴装新工艺，应用于生产还有一些问题未能得到很好的解决。本文通过对组装工艺过程中热应力、封装工艺等关键技术问题的研究，建立了热应力、焊接过程力学模型，为Flip-chip的生产进行了一些富有意义的探索。
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| 关 键 词： | Flip-chip芯片 微电子 表面贴装 组装工艺 热应力 封装工艺 |
| 文章编号： | 1000-1999(2004)05-0019-04 |
Research on Flip-chip Key Technologies |
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| RUI Yan-nian,LIU Kai-qiang,ZHANG Zhi-wei,CHENG Hui-ping.Research on Flip-chip Key Technologies[J].Journal of Suzhou University(Engineering Science Edition),2004,24(5):19-22. |
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| Authors: | RUI Yan-nian LIU Kai-qiang ZHANG Zhi-wei CHENG Hui-ping |
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| Abstract: | Flip-chip is a new kind of microelectronic surface mounting technics, but some problems of its application in production are not better solved yet. Through research on the key technologies as thermal stress and mounting technics in assembling process, this paper constructed mechanical model of thermal stress and welding process, made some significative exploration for the better production of Flip-chip. |
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| Keywords: | Flip-chip key technologies |
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