| 水洗钎剂下SnAgCu系钎料对不同基板的润湿特性 |
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| 引用本文： | 樊艳丽,张柯柯,王双其,程光辉,王要利,余阳春. 水洗钎剂下SnAgCu系钎料对不同基板的润湿特性[J]. 特种铸造及有色合金, 2006, 26(9): 604-606 |
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| 作者姓名： | 樊艳丽 张柯柯 王双其 程光辉 王要利 余阳春 |
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| 作者单位： | 河南科技大学 |
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| 基金项目： | 河南省高校杰出科研人才创新工程项目;河南省高校杰出科研人才创新工程项目;河南省高校青年骨干教师资助项目 |
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| 摘 要： | 选用商用水洗钎剂，采用润湿平衡法，研究了低银SnAgCu系钎料合金在表面贴装元器件及紫铜板上的润湿特性。研究结果表明，在Ag的质量分数为2．5％时，SnAg2．5Cu0．7钎料合金具有最大的润湿力和铺展面积及最小的润湿角。其润湿力高于现行商用SnAg3．8Cu0．7钎料合金，完全可满足表面组装元器件对其润湿性能的要求。
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| 关 键 词： | 无铅钎料 表面贴装元件 铜板 润湿性能 润湿力 |
| 文章编号： | 1001-2249（2006）09-0604-03 |
| 收稿时间： | 2006-03-21 |
| 修稿时间： | 2006-03-21 |
Wettability of SnAgCu Lead-free Solder Containing Low Ag for Different Substrate with Water-soluble Flux |
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| Fan Yanli,Zhang Keke,Wang Shangqi,Cheng Guanghui,Wang Yaoli,Yu Yangchun. Wettability of SnAgCu Lead-free Solder Containing Low Ag for Different Substrate with Water-soluble Flux[J]. Special Casting & Nonferrous Alloys, 2006, 26(9): 604-606 |
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| Authors: | Fan Yanli Zhang Keke Wang Shangqi Cheng Guanghui Wang Yaoli Yu Yangchun |
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| Abstract: | The wettability of SnAgCu solder containing low Ag on surface mount component and Cu substrate has been investigated by the wetting balance method with commercial water-soluble flux. The experimental results show that the highest wetting force and the biggest spreading area as well as the smallest wetting angle can be obtained with 2.5% Ag content, which can fully meet the wettability requirement of surface mount component due to its wetting force higher than that of commercial Sn3.8Ag0.7Cu alloy solder. |
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| Keywords: | Lead-free Solder Surface Mount Components Copper Substrate Wettability Wetting Force |
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