| Abstract: | Interfacial stress concentrations in rubber-filled epoxy resin and glass bead–filled epoxy resin systems were studied by a photoelastic method. We found that the stress concentration is independent of the applied stress and the particle size, but decreases with increasing chemical bonding at the interface between rubber and matrix. For the rubber-filled system, stress concentration is present at the equator of particles, while for either the untreated or treated glass bead-filled system, it is on the two poles. The effect of interfacial residual microstress on tensile fracture was studied, and results showed that the function of residual microstress is limited as tensile elongation increases. |
