| 漏印焊膏模版的自制工艺 |
| |
| 引用本文： | 史卫茜. 漏印焊膏模版的自制工艺[J]. 印制电路信息, 2005, 0(2): 63-64 |
| |
| 作者姓名： | 史卫茜 |
| |
| 作者单位： | 四川九州电器集团公司,621000 |
| |
| 摘 要： | 贴片加工少不了模版,该文介绍了利用现有加工印制板的设备加工漏焊膏模版的工艺流程,经应用、比较,证明此法不失为一种经济实用的加工方法。
|
| 关 键 词： | 模版 焊膏 铜片 化学蚀刻 |
The Process Technology of Solder Paste Printing Stencil |
| |
| Shi Weiqian. The Process Technology of Solder Paste Printing Stencil[J]. Printed Circuit Information, 2005, 0(2): 63-64 |
| |
| Authors: | Shi Weiqian |
| |
| Affiliation: | Shi Weiqian |
| |
| Abstract: | The stencil is important to SMT process, the paper mainly introduces technological process of manufacturing stencil by using machine making PCB, upon operation and comparison, the way is an economical and practical process method. |
| |
| Keywords: | stencil solder paste copper piece chemical-etching |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
|
