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加热去氩处理工艺对离子束混合沉积的C-SiC涂层阻氢性能的影响
引用本文:任丁,张瑞谦,黄宁康,曾俊辉,杜良,张东.加热去氩处理工艺对离子束混合沉积的C-SiC涂层阻氢性能的影响[J].原子能科学技术,2007,41(5):586-590.
作者姓名:任丁  张瑞谦  黄宁康  曾俊辉  杜良  张东
作者单位:1.四川大学 ;原子核科学技术研究所 ;教育部辐射物理和技术重点实验室,四川 ;成都 ;610064; ;2.中国工程物理研究院 ;核物理与化学研究所,四川 ;绵阳 ;621900 ;
摘    要:利用Ar+离子束混合技术在不锈钢基体上沉积C-SiC涂层,然后对部分样品进行加热去氩处理(400℃,30min),再用5keV氢离子源辐照样品。通过扫描电镜(SEM)的表面形貌观察、二次离子质谱仪(SIMS)的H与Ar元素深度分布和正离子质谱分析,研究去氩处理对氢离子辐照的C-SiC涂层的形貌和阻氢性能的影响。结果表明,经去氩处理,样品中不锈钢基体内的氢浓度降低了80%,显示出去氩处理的C-SiC涂层具有更高的阻氢性能。研究结果将为该技术应用于不锈钢基体上C-SiC涂层制备工艺的进一步改善提供依据。

关 键 词:C-SiC涂层    离子束混合沉积    阻氢    扫描电镜    二次离子质谱
文章编号:1000-6931(2007)05-0586-05
收稿时间:2006-06-09
修稿时间:2006-06-09

Effect of Eliminating Argon by Heat-Treatment on Hydrogen Resistance of C-SiC Films Deposited by Ion Beam Mixing
REN Ding,ZHANG Rui-qian,HUANG Ning-kang,ZENG Jun-hui,DU Liang,ZHANG Dong.Effect of Eliminating Argon by Heat-Treatment on Hydrogen Resistance of C-SiC Films Deposited by Ion Beam Mixing[J].Atomic Energy Science and Technology,2007,41(5):586-590.
Authors:REN Ding  ZHANG Rui-qian  HUANG Ning-kang  ZENG Jun-hui  DU Liang  ZHANG Dong
Affiliation:1. Key Lab for Radiation Physics and Technology of Education Ministry of China, Institute of Nuclear Science and Technology, Sichuan University, Chengdu 610064, China;2. Institute of Nuclear Physics and Chemistry, China Academy of Engineering and Physics, ;Mianyang 621900, China ;
Abstract:C-SiC films were deposited on the surface of stainless steel using ion beam mixing. In order to eliminate argon, some of the samples were heat-treated for 30 min at 400 ℃ before all were irradiated by 5 keV hydrogen ion beam. Scanning electron microscope (SEM) was used to analyze surface microtopology. Secondary ion mass spectrometry (SIMS) was used to analyze the depth distribution of H and Ar and mass spectra of positive species. The effect of eliminating argon by heat-treatment on the surface structure and hydrogen resistance of C-SiC films was studied. It is found that the concentration of hydrogen in stainless steel substrates after eliminated argon by heat-treatment is reduced 80%. This means that the technical of eliminating argon by heat-treatment can effectively improve hydrogen resistance of C-SiC films, which offers the theory proof of technical improvement in practical application.
Keywords:C-SiC films  ion beam mixing  hydrogen resistance  scanning electron microscope  secondary ion mass spectrometry
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