| 电子封装中的焊点及其可靠性 |
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| 引用本文： | 王谦,汪刚强,耿志挺,黄乐,唐祥云,马莒生. 电子封装中的焊点及其可靠性[J]. 电子元件与材料, 2000, 19(2): 24-26 |
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| 作者姓名： | 王谦 汪刚强 耿志挺 黄乐 唐祥云 马莒生 |
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| 作者单位： | 1. 清华大学,材料科学与工程系,北京,100084
2. 香港科技大学 机械工程系,中国香港 |
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| 摘 要： | 在电子封装中 ,焊点失效将导致器件乃至整个系统失效 ,焊点失效的起因是焊点中热循环引起的裂纹及其扩展。从焊点的微观组织及其变化、焊点失效分析、焊点可靠性预测等方面介绍了对电子封装焊点及其可靠性研究的状况。
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| 关 键 词： | 电子封装 焊点 可靠性 |
Solder Joint in Electronic Packages and Its Reliability |
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| WANG Qian,Shi-Wei Ricky LEE,WANG Gang-qiang,GENG Zhi-ting,HUANG Le,TANG Xiang-yun,Ma Ju-sheng. Solder Joint in Electronic Packages and Its Reliability[J]. Electronic Components & Materials, 2000, 19(2): 24-26 |
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| Authors: | WANG Qian Shi-Wei Ricky LEE WANG Gang-qiang GENG Zhi-ting HUANG Le TANG Xiang-yun Ma Ju-sheng |
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| Affiliation: | WANG Qian 1,WANG Gang qiang 1,Shi Wei Ricky LEE 2,GENG Zhi ting 1,HUANG Le 1,TANG Xiang yun 1,Ma Ju sheng 1 |
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| Abstract: | ELECTRONIC COMPONENTS & MATERIALS (China), Vol 19, No 2, P 24 26 (Apr 2000) In Chinese Failure of a single solder joint in an electronic package may cause the overall failure of the device, even the whole system Failures of solder joints usually result from the growth of creep/fatigue crack under thermal cycling The research of solder joints and its reliability is introduced, with respects of solder joint microstructure, failure analysis, reliability forecast, etc (12 refs ) |
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| Keywords: | electronic packages solder joints reliability |
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