| 封装装配技术所用材料的无铅化 |
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| 引用本文： | 杨建生. 封装装配技术所用材料的无铅化[J]. 电子与封装, 2005, 5(11): 17-20 |
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| 作者姓名： | 杨建生 |
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| 作者单位： | 天水华天科技股份有限公司,甘肃,天水,741000 |
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| 摘 要： | 本文简要叙述了无铅化立法确定的最后期限、凸点成形工艺、晶圆片凸点成形电镀技术、凸点下金属化及可靠性问题和无铅化材料的发展方向。从而说明，通过漏印板印刷和电镀的晶圆片凸点形成技术事例，证明可靠的无铅化技术是适合的。
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| 关 键 词： | 无铅化 凸点成形 凸点下金属化 电镀技术 可靠性 |
| 文章编号： | 1681-1070（2005）11-17-04 |
| 收稿时间： | 2005-04-11 |
| 修稿时间： | 2005-04-11 |
The Lead-free Challenge: Materials for Assembly and Packaging |
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| Yang Jian-sheng. The Lead-free Challenge: Materials for Assembly and Packaging[J]. Electronics & Packaging, 2005, 5(11): 17-20 |
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| Authors: | Yang Jian-sheng |
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| Affiliation: | Tianshui Huatian Microelectronics Co., Ltd Tianshui Gansu 741000 China |
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| Abstract: | The deadline of the legislation for lead-free, solder paste stencil printing bumping process, electroplating for wafer bumping, UBM, reliability issues and the way ahead are briefly stated in this paper. It is concluded that through the examples of stencil printing and electroplating wafer bumping describe the current status of lead-free alternatives for advanced interconnection technology, reliable lead-free technologies are available |
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| Keywords: | Lead-free Bumping Process UBM Electroplating Reliability |
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