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Fabrication of deep micro-holes in reaction-bonded SiC by ultrasonic cavitation assisted micro-EDM
Affiliation:1. Department of Mechanical Systems and Design, Tohoku University, Aramaki Aoba 6-6-01, Aoba-ku, Sendai 980-8579, Japan;2. Department of Mechanical Engineering, Faculty of Science and Technology, Keio University, Hiyoshi 3–14-1, Kohoku-ku, Yokohama 223-8522, Japan;3. Manufacturing Process Department, Faculty of Manufacturing Engineering, Universiti Teknikal Malaysia Melaka, Hang Tuah Jaya, 76100 Durian Tunggal, Melaka, Malaysia;1. Beijing Key Lab of Precision/Ultra-precision Manufacturing Equipments and Control, Department of Mechanical Engineering, Tsinghua University, Beijing 100084, China;2. State Key Laboratory of Tribology, Tsinghua University, Beijing 100084, China;1. Production Engineering Department, Jadavpur University, Kolkata 700032, India;2. Production Engineering Department, Jadavpur University, Kolkata 700032, India;1. School of Mechanical Engineering, Beijing Institute of Technology, Beijing 100081, China;2. School of Mechanical and Power Engineering, North University of China, Taiyuan 030051, China;3. China North General Power Group Co., Ltd., Datong 037000, China;1. Department of Mechanical Engineering, University of Auckland, Auckland, New Zealand;2. Department of Mechanical Engineering, Bundelkhand Institute of Engineering and Technology, Jhansi – 284128, India
Abstract:Ultrasonic vibration was applied to dielectric fluid by a probe-type vibrator to assist micro electrical discharge machining of deep micro-holes in ceramic materials. Changes of machined hole depth, hole geometry, surface topography, machining stability and tool material deposition under various machining conditions were investigated. Results show that ultrasonic vibration not only induces stirring effect, but also causes cloud cavitation effect which is helpful for removing debris and preventing tool material deposition on machined surface. The machining characteristics are strongly affected by the vibration amplitude, and the best machining performance is obtained when carbon nanofibers are added into the vibrated dielectric fluid. As test pieces, micro-holes having 10 μm level diameters and high aspect ratios (>20) were successfully fabricated on reaction-bonded silicon carbide in a few minutes. The hybrid EDM process combining ultrasonic cavitation and carbon nanofiber addition is demonstrated to be useful for fabricating microstructures on hard brittle ceramic materials.
Keywords:Ultrasonic vibration  Cavitation  Micro-electro discharge machining  Carbon nanofiber  Reaction-bonded silicon carbide  Ceramic material
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