| Sn-Zn系无铅焊料研究和亟待解决的问题 |
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| 引用本文： | 肖盈盈,周健,薛烽,孙扬善,张文典. Sn-Zn系无铅焊料研究和亟待解决的问题[J]. 电子与封装, 2006, 6(4): 10-14 |
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| 作者姓名： | 肖盈盈 周健 薛烽 孙扬善 张文典 |
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| 作者单位： | 东南大学材料科学与工程系,南京,210096;南京熊猫电子集团公司,南京,210002 |
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| 摘 要： | 文章介绍了无铅焊料研究的趋势及Sn-Zn系焊料研究取得的最新进展,分析了Sn-Zn系焊料与Sn-Ag系焊料研究的差距。最后,文章还总结了Sn-Zn系焊料研究面临的困难,找出了存在于基础研究和应用研究领域的若干问题,指出Sn-Zn系焊料的研究还需要更加深入。
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| 关 键 词： | 无铅焊料 润湿性 抗氧化性 抗腐蚀性 |
| 文章编号： | 1680-1070（2006）04-10-05 |
| 收稿时间： | 2005-10-25 |
| 修稿时间： | 2005-10-25 |
Development and Problems on Sn-Zn Lead-free Solders |
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| Xiao Ying-ying,Zhou Jian,Xue Feng,Sun Yang-shan,Zhang Wen-dian. Development and Problems on Sn-Zn Lead-free Solders[J]. Electronics & Packaging, 2006, 6(4): 10-14 |
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| Authors: | Xiao Ying-ying Zhou Jian Xue Feng Sun Yang-shan Zhang Wen-dian |
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| Affiliation: | 1. Department of Material Science and Engineering, Southeast University, Nanjing 210096 China; 2. Panda Electonics Group Company, Nanjing 210002, China |
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| Abstract: | The investigating trend of lead-free solders and the latest development on Sn-Zn were introduced in present paper. Problems on Sn-Zn Lead-free solders were point out by comparing them with Sn-Ag solders. These problems involved in fundamental material research and applied technology study. |
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| Keywords: | Lead-free solders Wettability Oxidation resistance Corrosion resistance |
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