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单个脉冲作用下熔融石英的温度和热应力研究
引用本文:李世雄,张正平,秦水介,陈德良. 单个脉冲作用下熔融石英的温度和热应力研究[J]. 激光与红外, 2016, 46(7): 786-791
作者姓名:李世雄  张正平  秦水介  陈德良
作者单位:贵州大学大数据与信息工程学院,贵州 贵阳 550025;贵州师范学院物理与电子科学学院,贵州 贵阳 550018;贵州大学 贵州省光电子技术及其应用重点实验室,贵州 贵阳 550025
基金项目:贵州省科学技术基金项目(No.黔科合J字[2013]2241,No.黔科合J字[2013]2253);贵州省教育厅特色重点实验室基金项目(No.黔教合KY[2014]217号)资助
摘    要:理论研究单个激光脉冲作用光学材料的温度和热应力分布模型,根据脉冲特征,分别建立适用于短脉冲和长脉冲的温度分布模型;进一步建立单个脉冲作用下的热应力模型。以熔融石英为例数值计算和分析了单个脉冲作用下的温度和热应力分布。研究结果表明,如果只求解单脉冲结束时的温度分布,长脉冲和短脉冲模型计算结果一致。单个激光脉冲辐照熔融石英,材料温度升高,如果温度达到材料融化或汽化温度,将导致材料的熔融汽化破坏,另一方面,在焦点区域温升不均匀,将导致热应力产生,如果热应力达到材料的力学破坏阈值,将诱导材料的热应力损伤。

关 键 词:激光脉冲;温度;热应力

Research on the temperature and thermal stress of fused silica irradiated by a laser pulse
LI Shi-xiong,ZHANG Zheng-ping,QIN Shui-jie,CHEN De-liang. Research on the temperature and thermal stress of fused silica irradiated by a laser pulse[J]. Laser & Infrared, 2016, 46(7): 786-791
Authors:LI Shi-xiong  ZHANG Zheng-ping  QIN Shui-jie  CHEN De-liang
Affiliation:College of Big Data and Information Engineering,Guizhou University,Guiyang 550025,China;School of Physics and Electronic Science,Guizhou Education University,Guiyang 550018,China;Key Lab of Photoelectron Technology and Application,Guizhou University,Guiyang 550025,China
Abstract:The models of temperature and thermal stress distribution in optical material irradiated by a laser pulse are researched theoretically.Based on the pulse characteristics,the temperature distribution models for long pulse and short pulse are built respectively,and on this basis,thermal stress distribution model is further set up.Taking fused silica as an example,the temperature and thermal stress distribution are calculated and analyzed.The results indicate that the temperature distribution profiles at the end of the pulse are same for long pulse and short pulse model.The theoretical analysis shows that the temperature near the spot center reaches the melting point or vapor point of fused silica,which leads to a melt damage or evaporation damage.The temperature rise in the focal areas is nonuniform,which leads to thermal stress.The thermal stress is greater than the fracture strength of sample,which induces the damage,such as thermal cracks.
Keywords:laser pulse  temperature  thermal stress
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