首页 | 本学科首页   官方微博 | 高级检索  
     


Effect of clay addition on the morphology and thermal behavior of polyamide 6
Authors:Ting‐Cheng Li  Jianhua Ma  Min Wang  Wuiwui Chauhari Tjiu  Tianxi Liu  Wei Huang
Affiliation:1. Key Laboratory of Molecular Engineering of Polymers of Chinese Ministry of Education, Department of Macromolecular Science, Fudan University, Shanghai 200433, People's Republic of China;2. Laboratory of Advanced Materials, Fudan University, Shanghai 200433, People's Republic of China;3. Department of Chemical Engineering, Chengde Petroleum College, Chengde 067000, People's Republic of China;4. Institute of Materials Research and Engineering, 3 Research Link, Singapore 117602
Abstract:The nanostructure, morphology, and thermal properties of polyamide 6 (PA6)/clay nanocomposites were studied with X‐ray scattering, differential scanning calorimetry (DSC), and transmission electron microscopy (TEM). The wide‐angle X‐ray diffraction (WAXD) and TEM results indicate that the nanoclay platelets were exfoliated throughout the PA6 matrix. The crystallization behavior of PA6 was significantly influenced by the addition of clay to the polymer matrix. A clay‐induced crystal transformation from the α phase to the γ phase for PA6 was confirmed by WAXD and DSC; that is, the formation of γ‐form crystals was strongly enhanced by the presence of clay. With various clay concentrations, the degree of crystallinity and crystalline morphology (e.g., spherulite size, lamellar thickness, and long period) of PA6 and the nanocomposites changed dramatically, as evidenced by TEM and small‐angle X‐ray scattering results. The thermal behavior of the nanocomposites was investigated with DSC and compared with that of neat PA6. The possible origins of a new clay‐induced endothermic peak at high temperature are discussed, and a model is proposed to explain the complex melting behavior of the PA6/clay nanocomposites. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 103: 1191–1199, 2007
Keywords:clay  morphology  nanocomposites  polyamides  thermal properties
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号