| 冲击载荷下BGA焊点应有限元模拟 |
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| 引用本文： | 张杰,杨平.冲击载荷下BGA焊点应有限元模拟[J].传感技术学报,2006,19(5):1591-1594,1598. |
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| 作者姓名： | 张杰 杨平 |
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| 作者单位： | 江苏大学微纳米科学技术研究中心,江苏,镇江,212013 |
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| 基金项目： | 广西省跨世纪学术和学科带头人科研项目，广西自然科学基金，江苏大学校科研和校改项目 |
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| 摘 要： | 从动力学角度分析了PBGA组件在高加速度冲击载荷下的响应.采用解析法与有限元分析相结合的方式考察了PBGA组件的结构参数和材料特性等因素对焊点应力的影响,并运用参量分析法比较了这些因素对焊点应力的影响程度.分析结果表明:在冲击载荷下,焊点位置对焊点应力的影响最大,应力峰值出现在PBGA器件的最外端焊点上,而焊点高度、BGA模量以及PCB模量对焊点应力影响较小.增大焊点直径或减小焊点模量均可有效减小焊点的应力,选择适当的PCB厚度也可降低焊点的应力.
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| 关 键 词： | 焊点 冲击 应力 参量分析 ANSYS |
| 文章编号： | 1004-1699(2006)05-1591-04 |
| 修稿时间： | 2006年7月1日 |
Finite Element Analysis on Solder Joint Stress of BGA under Shock Load |
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| Zhang Jie,Yang Ping.Finite Element Analysis on Solder Joint Stress of BGA under Shock Load[J].Journal of Transduction Technology,2006,19(5):1591-1594,1598. |
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| Authors: | Zhang Jie Yang Ping |
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| Affiliation: | Micro/Nano Science and Technology Research Center, Jiangsu University, Zhenjiang 212013, China |
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| Abstract: | The dynamic response of PBGA (plastic ball grid array) assembly under high acceleration load was investigated. Through the Analytical calculation and ANSYS simulation, several influencing factors to solder joint stress were studied and parametric analysis was adopted to compare the levels of each factor affecting the stress. The results indicate that the location of solder joint is the first important factor under shock load and the outmost solder balls of the PBGA experience maximum stresses. The solder joint height, the modulus of BGA and the modulus of PCB have little effect on the stress. The peak stress can be reduced effectively by increasing the diameter of the solder joints, reducing the modulus of the solder joint materials or choosing a suitable PCB thickness. |
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| Keywords: | ANSYS |
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