| 陶瓷四边引线扁平外壳设计中的几个问题 |
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| 引用本文： | 余咏梅. 陶瓷四边引线扁平外壳设计中的几个问题[J]. 电子与封装, 2005, 5(12): 20-22 |
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| 作者姓名： | 余咏梅 |
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| 作者单位： | 闽航电子有限公司,福建,南平,353001 |
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| 摘 要： | 陶瓷四边引线扁平外壳由于其具有I/O端子数多、重量轻、体积小、表贴式的特点,可 较好地满足集成电路芯片高可靠性封装要求。文章叙述了CQFP陶瓷四边引线扁平外壳设计中应注意的 一些问题。如对产品结构、内引线键合指、外引线外形、互连孔位置等关键技术工艺进行周密设计,才 能保证产品的质量。
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| 关 键 词： | 结构 键合指 外引线 互连孔位 装配 |
| 文章编号： | 1681-1070（2005）12-20-03 |
| 收稿时间： | 2005-04-30 |
| 修稿时间： | 2005-04-30 |
Some Questions in CQFP Design |
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| Yu Yong-mei. Some Questions in CQFP Design[J]. Electronics & Packaging, 2005, 5(12): 20-22 |
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| Authors: | Yu Yong-mei |
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| Affiliation: | Minhang Electronic Ltd., Nanping Fujian 353001, China |
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| Abstract: | CQFP can meet the requirements of high reliability packaging in IC, because of its multiple ports, light weight, small volume and SMT. Some questions in CQFP design are described in this paper, such as product structure, ILB-Inner Lead Bonding, ILB-Outer structure and VIA' s position, in order to pledge quality of product. |
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| Keywords: | Structure W/B ILB-Outer VIA's Position Assembly |
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