| 高可靠性18层刚挠结合印制板制作技术研究 |
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| 引用本文： | 彭卫红,刘东,朱拓,邓先友.高可靠性18层刚挠结合印制板制作技术研究[J].印制电路信息,2012(4):106-110. |
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| 作者姓名： | 彭卫红 刘东 朱拓 邓先友 |
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| 作者单位： | 深圳崇达多层线路板有限公司,广东深圳,518103 |
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| 摘 要： | 文章通过介绍一款用于航空方面的18层高可靠性刚挠结合印制板在压合、盲槽制作、半固化片开窗、覆盖膜压合等技术点的突破,提出一套适用于此类高层高阶刚挠结合印制板的制作技术。
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| 关 键 词： | 刚挠结合印制板 可靠性 制作技术 覆盖膜 |
Study on the manufacturing technology of high reliability 18 Layers flex-rigid PCB |
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| PENG Wei-hong,LIU Dong,ZHU Tuo,DENG Xian-you.Study on the manufacturing technology of high reliability 18 Layers flex-rigid PCB[J].Printed Circuit Information,2012(4):106-110. |
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| Authors: | PENG Wei-hong LIU Dong ZHU Tuo DENG Xian-you |
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| Affiliation: | PENG Wei-hong LIU Dong ZHU Tuo DENG Xian-you |
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| Abstract: | By taking a high reliability eighteen-layer flex-rigid PCB as an example,this paper studies on the manufacturing technology of lamination,blind slot,prepreg window and cover layer so as to bring forward the technology to manufacture such kind of multilayer and high-step flex-rigid PCB. |
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| Keywords: | Flex-rigid PCB Reliability Manufacturing Technology Cover Layer |
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