| 芯片贴装用银浆料的热物理与力学性能 |
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| 引用本文： | 甘卫平,刘妍,张海旺. 芯片贴装用银浆料的热物理与力学性能[J]. 电子元件与材料, 2008, 27(3): 25-28 |
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| 作者姓名： | 甘卫平 刘妍 张海旺 |
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| 作者单位： | 中南大学,材料科学与工程学院,湖南,长沙,410083 |
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| 摘 要： | 针对集成电路半导体芯片贴装,替代金-硅共熔焊或导电胶类粘结剂,研制了一种由银粉、玻璃粉和有机载体组成的低温烧结型银基浆料,其烧结温度峰值为430℃。研究了浆料的成分配比、工艺及其芯片贴装烧结工艺对浆料烧结体的微观组织、αL、λ、芯片组装的剪切力和热循环对芯片剪切力的影响规律。结果表明,当ζ(银粉:玻璃粉)=7:3,ζ(固体混合粉末:有机载体)=8:2时,芯片贴装后的综合性能最佳,冷热循环500次后其剪切力仅下降15%。
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| 关 键 词： | 电子技术 低温烧结型银玻璃粉浆料 半导体芯片贴装 |
| 文章编号： | 1001-2028(2008)03-0025-04 |
| 修稿时间： | 2007-11-27 |
Capabilities of thermal physics and mechanics of silver paste applied for chip assembly |
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| GAN Wei-ping,LIU Yan,ZHANG Hai-wang. Capabilities of thermal physics and mechanics of silver paste applied for chip assembly[J]. Electronic Components & Materials, 2008, 27(3): 25-28 |
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| Authors: | GAN Wei-ping LIU Yan ZHANG Hai-wang |
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| Affiliation: | GAN Wei-ping,LIU Yan,ZHANG Hai-wang(School of Materials Science , Engineering,Central South University,Changsha 410083,China) |
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| Abstract: | A new kind of low-temperature sintered paste that was composed of silver,glass powder and organic vehicle was developed,which could replace the fusion welding the Au/Si and conductive adhesives.The paste is applied to the semiconductor chip integrated circuits and sintering at a peak temperature of 430 ℃.The effect of the composition,preparation and sintering process on its micro structure,αL、λ and the shear force chip assembly and the influence of temperature circulation on shear force were researched.Results show,when ζ(silver:glass powder) is 7:3,ζ(organic vehicles:solid powder) is 2:8,the optimal collective properties can obtained,the shear force decreases 15% only after cold-hot 500 cycles. |
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| Keywords: | electron technology low-temperature sintered Ag/glass paste semiconductor chip assembly |
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