| 磁控溅射Cu膜的表面形貌演化研究 |
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| 引用本文： | 雒向东.磁控溅射Cu膜的表面形貌演化研究[J].半导体技术,2007,32(2):138-141. |
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| 作者姓名： | 雒向东 |
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| 作者单位： | 兰州城市学院,物理与工程技术学院,兰州,730070;中国空间技术研究院,兰州物理研究所,兰州,730000 |
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| 摘 要： | 采用磁控溅射工艺在单晶Si<111>衬底上制备300 nm厚的Cu膜,用原子力显微镜(AFM)观察薄膜表面形貌,研究工艺参数对Cu膜表面形貌的影响.结果表明:随着沉积温度、溅射功率及偏压的变化,Cu膜表面粗糙度历经了不同的演化过程.沉积粒子的扩散和晶粒生长之间的竞争决定了薄膜表面演化.
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| 关 键 词： | 磁控溅射 薄膜 表面形貌 |
| 文章编号： | 1003-353X（2007）02-0138-04 |
| 修稿时间： | 2006-08-19 |
Study on Surface Evolution of Cu Thin Films Deposited by Magnetron Sputtering Technology |
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| LUO Xiang-dong.Study on Surface Evolution of Cu Thin Films Deposited by Magnetron Sputtering Technology[J].Semiconductor Technology,2007,32(2):138-141. |
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| Authors: | LUO Xiang-dong |
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| Affiliation: | 1. Physics and Technical College, Lanzhou City University, Lanzhou 730070, China ; 2. Lanzhou Institute of Physics, China Academy of Space Technology, Lanzhou 730000, China |
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| Abstract: | Surface morphologies of 300 nm Cu thin films deposited by magnetron sputtering technology were obtained and studied by AFM. The effect of sputtering parameters on surface morphologies of the films was investigated. The results show that root-mean-square roughness of the film surfaces varies with substrate temperature, sputtering power, and bias voltage. The competition between the diffusion of deposited particles and grain growth of thin films determines surface evolution of thin films. |
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| Keywords: | magnetron sputtering thin film surface morphology |
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