| 微声学器件封装特性研究 |
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| 引用本文： | 杨轶,任天令,蔡坚,王水第,刘理天.微声学器件封装特性研究[J].微纳电子技术,2007(Z1). |
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| 作者姓名： | 杨轶 任天令 蔡坚 王水第 刘理天 |
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| 作者单位： | 清华大学微电子学研究所 北京100084 |
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| 摘 要： | 分别采用TO-CAN和SMT形式对微声学器件进行了封装,并对封装后的器件进行了耦合腔测试和指向性测试。测试结果表明,通过减小前入声孔直径大小,能够抑制微音频器件的高频响应;另外通过采用不同的封装结构参数,能够实现∞形和心脏形指向性的微超声器件。
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| 关 键 词： | 微声学器件 封装 指向性 |
Study on Packaging Characteristics of Micro Acoustic Devices |
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| YANG Yi,REN Tian-ling,CAI Jian,WANG Shui-di,LIU Li-tian.Study on Packaging Characteristics of Micro Acoustic Devices[J].Micronanoelectronic Technology,2007(Z1). |
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| Authors: | YANG Yi REN Tian-ling CAI Jian WANG Shui-di LIU Li-tian |
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| Abstract: | The micro acoustic devices were packaged by TO-CAN and SMT(surface mount technology) respectively.Frequency response and directive property of the packaged devices were measured by coupled cavity technique and corresponding setups.Test results reveal that high frequency response of micro audio frequency devices can be suppressed by decreasing the diameter of front inlet hole for sound.Different packaging parameters of micro ultrasonic devices result in ∞-shape and cordate directivity. |
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| Keywords: | micro acoustic device packaging directivity |
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