微波密封器件无腐蚀感应钎焊工艺研究

通过对铝合金微波器件接头进行局部镀镍铜，选用双面有铜层的聚四氟覆铜板，实现了微波器件接头和聚四氟材料封盖的可钎焊性。采用优化的漏印网板添加焊膏，有效地控制了焊膏预置量，保证了钎焊缝的一致性。通过优化设计感应加热线圈，解决了矩形接头的感应加热温度场均匀一致性问题;通过对微波器件感应钎焊的工艺过程研究，获得了稳定的工艺参数。利用感应加热的快速、局部的优点，实现了微波密封器件局部快速钎焊。

Study on Non-corrosive Induction Soldering Process of Microwave Sealing Device

The local nickel-plated copper is used for the aluminum alloy microwave device joint, and the polytetrafluorous copper sheet with copper layer on both sides is used to realize the solderability of microwave device joint and teflon material. The optimized leakage screen is used to add the solder paste, effectively control the preset amount of the solder paste and ensure the consistency of the soldering seam. The uniformity of the induction heating temperature field of the rectangular joint is solved by optimizing the induction heating coil. The stable process parameters are obtained through studying the technological process of the induction soldering of the microwave device. The advantages of rapidity and locality of the induction heating enable the soldering of the microwave sealed device to be realized quickly and locally.