聚合物整体灌装电路板热应力分析

电路板的聚合物整体灌装是一种提高电子器件在极端工况下可靠性的方法。针对该方法所面临的热应力失效问题，采用有限元数值方法研究了含15个元器件的整体灌装电路板在环境温度改变和器件产热两种热载荷下的热应力分布，并通过参数化模拟分析了不同几何和材料参数对元器件及其接合层中热应力分布的影响。结果表明整体灌装加剧了IC器件及其接合层的热应力，该模拟工作为提高整体灌装方案的热应力可靠性提供参考。

Thermal stress analysis for plate-level encapsulation with polymer potting

Plate-level encapsulation using polymer potting is a method to enhance structural reliability of electronics working in harsh conditions. The failure of the potted package due to thermal stress is analyzed using finite element numerical simulations. Specifically, the thermal stress distribution in a potted plate containing 15 IC units under two kinds of thermal loads: the environmental temperature change and the heat generation by working ICs was investigated. Parametric study was carried out to determine the effects of different geometrical and material parameters on the thermal stress. The simulation results show an evident stress increase in the IC packages and interconnections after potting. This work can provide guidance for the reliability design of the plate-level potted electronic package.