| 某型电子设备连接铆钉断裂分析 |
| |
| 引用本文： | 肖滨,常选仓,关迪,刘杰.某型电子设备连接铆钉断裂分析[J].电子机械工程,2018,34(2):17-19, 23. |
| |
| 作者姓名： | 肖滨 常选仓 关迪 刘杰 |
| |
| 作者单位： | 中国电子科技集团公司第二十九研究所,中国电子科技集团公司第二十九研究所,中国电子科技集团公司第二十九研究所,中国电子科技集团公司第二十九研究所 |
| |
| 摘 要： | 针对某型电子设备在使用中出现的铆钉断裂现象，建立了结构的全尺寸有限元模型，并根据断面特征定量反推了输入载荷。随后通过仿真分析，准确预测了铆钉的断裂位置，还原了铆钉断裂过程并给出了铆钉的疲劳寿命。计算结果显示过大装配应力和来自载机的振动载荷共同导致了铆钉疲劳破坏。
|
| 关 键 词： | 铆钉断裂 有限元模型 疲劳寿命 装配应力 疲劳破坏 |
Rivet Fracture Analysis for an Electronic Equipment |
| |
| XIAO Bin,CHANG Xuan-cang,GUAN Di and LIU Jie.Rivet Fracture Analysis for an Electronic Equipment[J].Electro-Mechanical Engineering,2018,34(2):17-19, 23. |
| |
| Authors: | XIAO Bin CHANG Xuan-cang GUAN Di and LIU Jie |
| |
| Affiliation: | The 29th Research Institute of CETC,The 30th Research Institute of CETC,The 31th Research Institute of CETC and The 32th Research Institute of CETC |
| |
| Abstract: | In order to investigate the cause of rivet fracture for an electronic equipment, a full-scale finite element model is established, and load conditions are achieved based on quantitative analysis on fracture surface. Then, the fracture position of the rivet is predicted accurately by numerical simulation, the rivet fracture process and the fatigue life are given. It is shown that the too large assembly stress and the vibration load from the carrier together cause the rivet fatigue failure. |
| |
| Keywords: | rivet fracture finite element model fatigue life assembly stress fatigue failure |
|
| 点击此处可从《电子机械工程》浏览原始摘要信息 |
|
点击此处可从《电子机械工程》下载全文 |
