大尺寸楔形腔封装技术研究

针对楔形腔锥形光纤倏逝场耦合结构无法脱离高精度调节系统的情况，设计制备了大尺寸楔形腔锥行光纤耦合点无胶封装结构，使得楔形腔耦合结构摆脱了三维调节平台。对封装前后品质因数以及温度非线性进行测试得到：楔形腔封装前后品质因数Q值与温度非线性不变，该封装结构封装前后不改变回音壁模式全反射界面介质，实现封装前后Q值不变，但在抗环境污染，抗破坏等方面能力较差。针对上述性能上的不足，首次设计制备大尺寸楔形腔锥形光纤低折射率紫外胶封装结构，对封装结果进行测试。结果表明：紫外胶封装结构封装前后使得楔形腔品质因数Q值降低约一个数量级，耦合效率、谐振模式到了优化，可以有效的抑制热噪声。封装结构实现Q值的长时间保持，不受环境中颗粒、粉尘、折射率变化等对谐振模式的影响，机械稳定性大于5G。

Research on Packaging Technology of Large Size Wedge-resonator

The wedge shape cavity fiber optic evanescent field coupling structure can not be divorced from the high precision control system, design and fabrication of large size tapered conical cavity fiber coupling point without glue package structure, the cavity coupling structure to get rid of the three-dimensional wedge adjusting platform. The quality factor Q and temperature nonlinearity before and after packaging are tested: the quality factor Q and the temperature nonlinearity unchanged. The package structure does not change the echo wall mode and total reflection interface medium before and after encapsulation, and the Q value is constant before and after encapsulation, but the capability of resisting environmental pollution and resisting damage is poor. Aiming at the shortage of the performance, a large wedge-shaped tapered fiber low refractive index UV adhesive package was designed and fabricated for the first time.The results showed that the test package before and after UV glue packaging packaging structure allows the wedge cavity quality factor Q value decreased about one order of magnitude. The coupling efficiency, to optimize the resonant mode, can effectively suppress the thermal noise. The encapsulation structure realizes the Q value for a long time, without the influence of the particles, dust and refractive index changes in the environment on the resonant mode, and the mechanical stability is greater than 5G.