| 影响Mo-Cu合金电热性能的因素 |
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| 引用本文： | 李增峰 刘海彦 汤慧萍 黄愿平 张晗亮 李程 谈萍 黄瑜. 影响Mo-Cu合金电热性能的因素[J]. 功能材料, 2007, 38(A02): 505-507 |
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| 作者姓名： | 李增峰 刘海彦 汤慧萍 黄愿平 张晗亮 李程 谈萍 黄瑜 |
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| 作者单位： | 西北有色金属研究院粉冶所,陕西西安710016 |
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| 摘 要： | 主要叙述了适用封接用Mo-Cu导热导电性能的测定方法，论述了Cu和Ni含量对钼铜合金热电性能的影响：机械活化处理及热处理等因素对钼铜合金热电性能的影响。认为Ni等少量杂质元素的加入，Mo-Cu合金材料的热电性能降低；机械活化处理使Mo-Cu合金的热导和导电性能下降；Cu含量的加入和适当的热处理使Mo-Cu合金的热电性能提高。
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| 关 键 词： | Mo-Cu 导热系数 电阻率 |
| 文章编号： | 1001-9731（2007）增刊-0505-03 |
| 修稿时间： | 2007-03-09 |
Effect of various factors on the thermal and electric conductivity of Mo-Cu alloy |
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| LI Zeng-feng, LIU Hai-yan, TANG Hui-ping, HUANG Yuan-ping, ZHANG Han-liang, LI Cheng, TAN Ping, HUANG Yu. Effect of various factors on the thermal and electric conductivity of Mo-Cu alloy[J]. Journal of Functional Materials, 2007, 38(A02): 505-507 |
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| Authors: | LI Zeng-feng LIU Hai-yan TANG Hui-ping HUANG Yuan-ping ZHANG Han-liang LI Cheng TAN Ping HUANG Yu |
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| Abstract: | the test method of thermal and electric conductivity of Mo-Cu alloy for sealing materials, effect of Cu and Ni contents on the thermal and electric conductivity of Mo-Cu alloy, effect of mechanical alloying and heat treatment on the thermal and electric conductivity of Mo-Cu alloy has been discussed respectively in this paper. The results show that small amount element such as Ni can decrease the electric conductivity of Mo-Cu alloy; the thermal and electric conductivity of Mo-Cu alloy decreased after mechanical activation treatment of composite powders; the thermal and electric conductivity of Mo-Cu alloy increased with elevated Cu content and properly heat treatment. |
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| Keywords: | Mo-Cu coefficient of thermal conductivity electric receptivity |
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