| 不同粉末冶金工艺制造的CuCr触头的微观组织差异及对电性能的影响 |
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| 引用本文： | 傅肃嘉.不同粉末冶金工艺制造的CuCr触头的微观组织差异及对电性能的影响[J].电工材料,2003(2):3-9. |
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| 作者姓名： | 傅肃嘉 |
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| 作者单位： | 浙江省冶金研究院,杭州,310007 |
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| 摘 要： | 评述了熔渗法和混粉烧结法两种粉末冶金工艺制备的CuCr触头的微观结构差异及对电开断性能的影响。与熔渗法相比，烧结法制备的CuCr触头具有更好的抗熔焊性能，更低的截流值和更好的吸放气性能，但因其机械强度较低故耐压可能不如熔渗法触头。对两种工艺提出了改进的建议。
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| 关 键 词： | CuCr触头 微观组织 粉末冶金工艺 真空断路器 真空灭弧室 |
| 修稿时间： | 2003年4月7日 |
Microstructures and Interrupting Behaviors of CuCr Contacts Made by P/M Manufacture Processes |
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| FU Su-jia.Microstructures and Interrupting Behaviors of CuCr Contacts Made by P/M Manufacture Processes[J].Electrical Engineering Materials,2003(2):3-9. |
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| Authors: | FU Su-jia |
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| Abstract: | Microstructure characteristics and their effects on interrupting behaviors were discussed for CuCr vacuum contact materials made by P/M sintering and infiltration processes. Compared with that of infiltration process, the contact made by sintering process shows better anti-welding ability, lower chopping current, and more excellent gas absorption ability, but its dielectric strength is not as good as that of infiltration CuCr contact duo to its relative low mechanical strength. Suggestions for further improvement of these contacts were also presented. |
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| Keywords: | CuCr contact materials sintering processes infiltration processes microstructure switching behaviors |
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