Characteristics of body-tied triple-gate pMOSFETs

Body-tied triple-gate pMOSFETs were fabricated using bulk Si wafers and characterized. Process steps to implement the devices are explained briefly. Device characteristics of the triple-gate pMOSFETs were compared with those of the conventional planar channel device. While maintaining low off-leakage currents and threshold voltages similar to those of planar pMOSFETs in the parallel arrayed 30 000 transistors, the body-tied triple-gate MOSFETs showed about 74 mV/dec of subthreshold swing (92 mV/dec for conventional devices) and a drain-induced barrier lowering of 34 mV/V (92 mV/V for conventional devices). It was also addressed that I/sub SUB//I/sub D/ of the body-tied triple-gate is lower than that of the planar channel device.