| 化学镀Ni-Sn-P合金的研究进展 |
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| 引用本文： | 王宏智,彭海波,陈君,王津生.化学镀Ni-Sn-P合金的研究进展[J].电镀与涂饰,2007,26(6):51-54. |
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| 作者姓名： | 王宏智 彭海波 陈君 王津生 |
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| 作者单位： | 天津大学化工学院应化系,天津,300072 |
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| 摘 要： | 介绍了近年来国内外在化学镀Ni-Sn-P合金镀层方面的研究进展,探讨了镍盐含量、锡盐含量、还原剂含量、络合剂含量、温度和pH等因素对化学镀Ni-Sn-P合金的镀速及镀层质量的影响。分析了镀层的表面形貌、结构及性能,概述了化学镀Ni-Sn-P合金镀层的应用及目前所存在的问题。
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| 关 键 词： | 化学镀 Ni-Sn-P合金 镀速 镀层质量 |
| 文章编号： | 1004-227X(2007)06-0051-04 |
| 修稿时间： | 2006年9月30日 |
Research progress of electroless Ni-Sn-P alloy plating |
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| WANG Hong-zhi,PENG Hai-bo,CHEN Jun,WANG Jin-sheng.Research progress of electroless Ni-Sn-P alloy plating[J].Electroplating & Finishing,2007,26(6):51-54. |
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| Authors: | WANG Hong-zhi PENG Hai-bo CHEN Jun WANG Jin-sheng |
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| Abstract: | The research progress of electroless Ni-Sn-P alloy plating at home and abroad in recent years were introduced.The effects of nickel salt concentration,tin salt concentration,reductant concentration,complexing agent concentration,temperature and pH on the deposition rate and deposit quality of electroless Ni-Sn-P alloy plating were discussed.The surface morphology,structure and performance of deposit were analyzed,and the applications and existing problems of electroless Ni-Sn-P alloy plating were summarized. |
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| Keywords: | electroless plating Ni-Sn-P alloy deposition rate deposit quality |
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