| 磁控溅射技术新进展及应用 |
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| 引用本文： | 张继成,吴卫东,许华,唐晓红.磁控溅射技术新进展及应用[J].材料导报,2004,18(4):56-59. |
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| 作者姓名： | 张继成 吴卫东 许华 唐晓红 |
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| 作者单位： | 中国工程物理研究院激光聚变研究中心,绵阳,621900 |
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| 摘 要： | 主要简介了磁控溅射技术的基本原理、基本装置、近年来出现的新技术(多靶磁控溅射技术、磁场扫描法、非平衡磁控溅射、脉冲磁控溅射技术、磁控溅射技术与其它成膜技术相结合等),以及国内外利用磁控溅射技术在多层膜和化合物薄膜制备方面取得的一些成果.
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| 关 键 词： | 磁控溅射 磁控溅射新技术 薄膜制备 |
The Recent Developments and Applications of Magnetron Sputtering |
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| ZHANG Jicheng WU Weidong XU Hua TANG Xiaohong.The Recent Developments and Applications of Magnetron Sputtering[J].Materials Review,2004,18(4):56-59. |
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| Authors: | ZHANG Jicheng WU Weidong XU Hua TANG Xiaohong |
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| Abstract: | In this paper,the basic concept,reaction equipment and application of magnetron sputtering,especially its use in fabrication of multiplayer films and mixture films,are reviewed. At the same time,the new technique formed recently is also discussed,including multi-source system,scanning magnetron cathode,pulsed magnetron supttering, unbalanced magnetron sputtering, and the combination of magnetron sputtering with other surface coating techniques. |
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| Keywords: | magnetron sputtering new techniques film fabrication |
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