In-Situ observation on microfracture behavior ahead of the crack tip in 63Sn37Pb solder alloy |
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Authors: | Ying Ding Chunqing Wang Yanhong Tian and Binbin Zhang |
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Affiliation: | (1) Microjoining Laboratory, School of Materials Science and Engineering, Harbin Institute of Technology, 150001 Harbin, People's Republic of China |
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Abstract: | in-situ transmission electron microscopy (TEM) tensile tests on as-cast and aged 63Sn37Pb solder alloys were conducted, and the fracture
behavior in nanometer scale ahead of the crack tip was inspected and discussed. Results show that the fracture was completed
by connecting the discontinuous cracks or voids. Dislocation behavior was concentrated along the grain boundaries for as-cast
samples, and displayed mainly as dislocation climb. The crack was intergranular dominated under the lower strain rate. While
remarkable mutual dislocation emission was detected in the aged solder. Transgranular cracks were dominant in the fractured
area, and they propagated by linking up with the nanometer scale cracks ahead of the crack tips under the effective promotion
of the inverse dislocation emission. At the same time, the partial interphase or intergranular cracks in the thinned area
were also found. Under this condition, a new critical stress intensity factor K
c
′ to define the mutual dislocation emission was proposed. |
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Keywords: | |
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