Fast diffusers in a thermal gradient (solder ball) |
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Authors: | J.R. Lloyd N.A. Connelly Xiaoli He K.J. Ryan B.H. Wood |
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Affiliation: | 1. Department of Chemical Engineering, National Tsing Hua University, Taiwan;2. High Entropy Materials Center, National Tsing Hua University, Taiwan |
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Abstract: | The behaviour of Ni in Sn under a thermal gradient driving forces was calculated considering boundary conditions typical of lead-free solder applications. The steady state concentration profiles for a fast diffuser were determined and the consequences for reliability discussed. |
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