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Fast diffusers in a thermal gradient (solder ball)
Authors:J.R. Lloyd  N.A. Connelly  Xiaoli He  K.J. Ryan  B.H. Wood
Affiliation:1. Department of Chemical Engineering, National Tsing Hua University, Taiwan;2. High Entropy Materials Center, National Tsing Hua University, Taiwan
Abstract:The behaviour of Ni in Sn under a thermal gradient driving forces was calculated considering boundary conditions typical of lead-free solder applications. The steady state concentration profiles for a fast diffuser were determined and the consequences for reliability discussed.
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