| 超细铜粉的化学镀锡及其抗氧化性能研究 |
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| 引用本文： | 王尚军,方晓祖. 超细铜粉的化学镀锡及其抗氧化性能研究[J]. 电子元件与材料, 2008, 27(10) |
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| 作者姓名： | 王尚军 方晓祖 |
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| 作者单位： | 中国兵器科学研究院,宁波分院,浙江,宁波,315103 |
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| 基金项目： | 浙江省宁波市自然科学基金 |
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| 摘 要： | 以水合肼还原法制备出平均粒径约1μm的超细铜粉,并对其进行化学镀锡。研究了镀锡层对复合粉末微观形貌及抗氧化性能的影响。结果表明:镀覆质量分数50%的锡后,复合粉末平均粒径有所减小,但在空气中的氧化起始温度从120℃提高到220℃,与镀银层相比,镀锡层在较低温度区间对铜粉抗氧化具有优势。
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| 关 键 词： | 金属材料 超细铜粉 化学镀锡 抗氧化 热重分析 |
Study on electroless tin plating and antioxidation properties of ultrafine copper powder |
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| WANG Shang-jun,FANG Xiao-zu. Study on electroless tin plating and antioxidation properties of ultrafine copper powder[J]. Electronic Components & Materials, 2008, 27(10) |
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| Authors: | WANG Shang-jun FANG Xiao-zu |
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| Affiliation: | WANG Shang-jun,FANG Xiao-zu (Ningbo Branch of Ordnance Science institute of China,Ningbo 315103,Zhejiang Province,China) |
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| Abstract: | Ultrafine copper powders with an average particle size of about 1 μm were prepared by hydrazine hydrate reduction method, and then was plated with tin by electroless plating. The effects of tin plating layer on the micromorphologies and antioxidation properties of composite powders were investigated. The results show that the average particle size of composite powders plated with tin of 50% (mass fraction) would be slightly decreased, while the starting oxidation temperature would be increased from 120 ℃ to 220 ℃. Compared with silver plating layer, tin plating layer has advantages in the antioxidation of copper powders in lower temperature range. |
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| Keywords: | metallic material ultrafine copper powders electroless tin plating antioxidation thermogravimetric analysis |
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